SILICON WAFER MANUFACTURING FACILITY
Processing equipment needed for the process through which silicon ingot important for solar cell production is made with wafers.
Squaring & Grinding Machine
- Tool : Diamond O.D Saw & Diamond Cup Wheel
- Squaring : Cuts four sides of silicon ingot with a square brick
- Surface Grinding : Grinds a surface side squared in desired size and roughness
- Round Grinding : Cylindrical grinding of a irregular round side at a desired size
- High-speed, high-precision and loading & unloading auto processing
Processing Method
SQUARE CUTTING
SURFACE GRINDING
ROUND GRINDING
