SILICON WAFER MANUFACTURING FACILITY
Processing equipment needed for the process through which silicon ingot important for solar cell production is made with wafers.
Cropping 2 axis Machine
- Tool : Diamond O.D Saw
- Top & Tail Cutting : Cuts both ends of silicon ingot
- Cropping : Cuts silicon ingot in fixed lengths
- Sample Cutting : Cuts the sample of 1~2mm thick
- High-speed and multi-purpose cutting and precision
Processing Method
Cropping
